NAICS 334413 semiconductor and related device manufacturing obligations

Device manufacturing, not a chip-factory inventory

NAICS 334413 is semiconductor and related device manufacturing. Contracting officers assign it when the principal product is semiconductors, integrated circuits, and related devices as the Census class groups them. This $1,629,204,350.85 is that manufacturing tag. It is not a count of wafers produced, not a national foundry map, and not NAICS 334111 electronic computer manufacturing.

Six thousand three hundred seventy-four awards produced a mean of about $256,000. Federal semiconductor buys can mix catalog microelectronics, radiation-hardened parts, and specialized devices, which sits between a small diode order and a mega foundry grant. The packet does not count dies, nodes, or fabs.

Electronic computer manufacturing is a finished-system class. A laptop or server buy tagged 334111 does not sit in $1.6 billion under 334413.

Awards versus chips delivered

The 6,374-award count is an award-identifier count, not a unit count of semiconductors. USAspending may still group multiple delivery orders into awards. Dividing $1,629,204,350.85 by 6,374 awards is a mean obligation per award, not a price per wafer.

Manufacturing contracts often obligate estimated quantities and pay as lots ship. Unused options leave obligated balances unpaid. Treating $1.6 billion as chips already received would overstate cash.

What this total excludes

Assistance that funds semiconductor research or construction often lacks NAICS or uses a different class and does not automatically enter $1,629,204,350.85. In-house government labs that fabricate prototypes are not 334413 contracts. Component work tagged to a broader electronic-component NAICS follows the principal code.

Related-device manufacturing in this Census class is still a 334413 tag. Neighboring instrument or computer codes are separate hubs. Radiation-hardened parts and catalog microelectronics can share 334413 when that is the principal product. The $1,629,204,350.85 total does not split those lots across the 6,374 awards.

How to use the 334413 hub

Read $1.6 billion and 6,374 awards as the semiconductor-device manufacturing tag, then open the semiconductor and related device manufacturing industry page for award-level fields. Rank 334 electronics codes on the all-industries index without converting this device class into a computer-system or foundry-grant total.

This guide does not add process-node lists because they are not in the facts object. A printed-circuit assembly tagged to another 334 electronic-component class is not this device book. Quote obligations, not wafers, and keep foundry maps out of the sentence because they are not in the facts object.

Classification limits

Semiconductor devices are not finished computers and not a grant program by themselves. Mixed board-and-chip kits follow the principal NAICS. SpendingVault reports the tagged 334413 sum.

Extract updates will move $1,629,204,350.85 and 6,374 with USAspending.

Device tags versus grants and finished computers

Semiconductor assistance and construction funding often travel as grants or as a different NAICS. Those dollars do not automatically join $1,629,204,350.85. This hub is contract actions tagged 334413: devices as the Census manufacturing class defines them. Six thousand three hundred seventy-four awards at a mean of about $256,000 can mix radiation-hardened parts, catalog microelectronics, and specialized lots. The packet does not say which mix. It does not count nodes, wafers, or fabs.

Electronic computer manufacturing is a finished-system class. A laptop or server tagged there is not this device total. Related-device manufacturing still belongs in 334413 when that is the principal product. Open the semiconductor and related device manufacturing industry page for award-level fields behind the $1.6 billion. Rank 334 electronics codes on the all-industries index. Cite USAspending.gov. Obligations remain distinct from outlays on open delivery orders. Extract updates will move $1,629,204,350.85 and 6,374 together. A searcher asking how much the federal government spent on chips should still separate device manufacturing from finished computers and from assistance that omits NAICS. The $1,629,204,350.85 figure answers the NAICS 334413 question only. The 6,374-award count answers how many award identifiers carried that tag, not how many wafers shipped. Open the semiconductor and related device manufacturing industry page, then compare other 334 electronics codes on the all-industries index. Keep the language to obligations recorded in USAspending.gov, and do not convert the mean of about $256,000 into a price per die.

Questions

How much is obligated under NAICS 334413?

Semiconductor and related device manufacturing contracts in USAspending show $1,629,204,350.85 in obligations across 6,374 awards. That is a device-manufacturing tag, not a foundry census and not electronic-computer manufacturing. The figure is obligations, not outlays. Assistance without a NAICS code is excluded from this industry extract.

What is the average semiconductor-device award?

Dividing $1,629,204,350.85 by 6,374 awards yields about $256,000. That mean mixes catalog parts and specialized microelectronics in this extract. It is not a price per wafer or per die. The packet does not publish a median, a unit count, or a process-node list.

Does this include computer manufacturing?

Only contract actions tagged 334413. Electronic computer manufacturing is a separate NAICS class for finished systems. Mixed system-and-device buys follow the principal code the officer selected. This $1.6 billion is the semiconductor-device tag. Use each industry hub for its own Census class on SpendingVault.

Are these dollars already paid to chip makers?

No. USAspending reports obligations on this hub, not outlays. Open delivery orders and unused options can leave balances unliquidated after the award posts. The 6,374-award count is not a proof of wafers received. Cite USAspending.gov for the tagged extract on SpendingVault.